Electronics R&D & Product Design
From idea to production-ready design. Schematic, PCB layout, firmware, prototype - Full support for every R&D stage.
R&D Service Overview
Concept Development & Feasibility Study
- Technical requirements analysis
- Component selection & sourcing
- Cost estimation & BOM optimization
- Technical feasibility assessment
Schematic & PCB Design
- Multi-layer PCB (2-16 layers)
- High-speed design (DDR, USB 3.0, PCIe)
- Signal integrity & EMI/EMC calculation
- Stack-up planning & impedance control
Firmware & Software Development
- Embedded C/C++ programming
- RTOS integration (FreeRTOS, Zephyr)
- Bootloader & OTA updates
- Driver development & HAL
Prototype Development & Testing
- Rapid prototyping (1-2 weeks)
- Functional testing & validation
- Design iteration & optimization
- Bring-up & debugging
DFM (Design for Manufacturing)
- DFM check & optimization
- Panelization planning
- Test point placement
- Production file preparation
Documentation & Support
- Schematic & assembly drawings
- BOM & manufacturing docs
- User manual & technical docs
- After-sales technical support
Technology Stack
Hardware Platforms
- •ESP32/ESP32-S3
- •STM32 (F0/F1/F4/H7)
- •Nordic nRF52/nRF53
- •ARM Cortex-M/A
- •Raspberry Pi
- •Arduino
Wireless Connectivity
- •Wi-Fi 4/5/6
- •Bluetooth 5.0/5.1/5.2
- •LoRa/LoRaWAN
- •Zigbee 3.0
- •Thread
- •NB-IoT/LTE-M
- •4G/LTE
Software & OS
- •FreeRTOS
- •Zephyr
- •Arduino
- •ESP-IDF
- •STM32Cube
- •PlatformIO
- •Embedded Linux
Design Tools
- •Altium Designer
- •KiCad
- •EasyEDA
- •OrCAD
- •LTspice
- •MATLAB/Simulink
Featured Projects
Case Studies - R&D Projects
Smart Home IoT Gateway
Used ESP32-S3 as main SoC, integrated Zigbee coordinator (CC2652), BLE mesh. 4-layer PCB with RF optimization, antenna matching.
View ProjectUsed ESP32-S3 as main SoC, integrated Zigbee coordinator (CC2652), BLE mesh. 4-layer PCB with RF optimization, antenna matching.
Industrial Sensor Node - Low Power
STM32L4 ultra-low-power MCU, LoRa SX1262 module, optimized power management design. 2-layer PCB with conformal coating protection.
View ProjectSTM32L4 ultra-low-power MCU, LoRa SX1262 module, optimized power management design. 2-layer PCB with conformal coating protection.
Medical ECG Monitor - Portable
Analog front-end (AFE) ADS1293, STM32F4 DSP processing, BLE 5.0. 4-layer PCB with analog-digital isolation, shielding design.
View ProjectAnalog front-end (AFE) ADS1293, STM32F4 DSP processing, BLE 5.0. 4-layer PCB with analog-digital isolation, shielding design.
Interested in working with us on your next project?
Start Your ProjectPricing & Lead Time
Prices below are estimates for standard R&D projects. Exact pricing depends on complexity, timeline, and specific requirements.
Basic Design
- Schematic design (simple, < 100 components)
- PCB layout 2-4 layers
- Gerber files & BOM
- 1 revision included
Standard R&D
- Full schematic & PCB design (4-6 layers)
- Firmware basic functions
- Prototype assembly (5 pcs)
- Functional testing
- 2 revisions included
Advanced R&D
- Complex multi-board design (8+ layers)
- Full firmware development
- Prototype iterations (3 rounds)
- Compliance testing (FCC/CE pre-test)
- Full documentation
- Unlimited revisions